Design and implementation of a reflow oven for SMD soldering

dc.contributor	Graduate Program in Systems and Control Engineering.
dc.contributor.advisor	Denizhan, Yağmur.
dc.contributor.advisor	Özkan, Mehmed.
dc.contributor.author	Korkmaz, Caner.
dc.date.accessioned	2023-03-16T11:34:49Z
dc.date.available	2023-03-16T11:34:49Z
dc.date.issued	2010.
dc.identifier.other	SCO 2010 K67
dc.identifier.uri	http://digitalarchive.boun.edu.tr/handle/123456789/15662
dc.description.abstract	Reflow soldering is a process in which components that are placed onto the solder paste applied PCB, are assembled by carefully heating the assembly in order to solder the joints. The assembly may be heated by several methods but the convection reflow seems a prevailing alternative because of its effectiveness in heat transfer and insensitivity to material type or color. Hence, a cheap and industry standard conforming design and implementation of convection reflow oven by using a standard kitchen oven is aimed in this study. For process control, several control algorithms were applied and their results were compared.
dc.format.extent	30cm.
dc.publisher	Thesis (M.S.)-Bogazici University. Institute for Graduate Studies in Science and Engineering, 2010.
dc.relation	Includes appendices.
dc.relation	Includes appendices.
dc.subject.lcsh	Surface mount technology.
dc.subject.lcsh	Solder and soldering.
dc.title	Design and implementation of a reflow oven for SMD soldering
dc.format.pages	xiv, 68 leaves;